MANUFACTURING METHODS TO REDUCE SURFACE PARTICLE IMPURITIES AFTER A PLASMA PROCESS

摘要: Manufacturing methods are disclosed to reduce surface particle impurities after a plasma process (e.g., etch, deposition, etc.) by repelling particles trapped within wells on microelectronic workpieces termination of the process. Rather than turn off pressure and source power at process, embodiments first enter sequence adjust parameters repel in well order or eliminate prior terminating During this sequence, certain maintain an electrostatic field above wafer utilizing low density ion energy conditions that help from workpiece. The allow for be exhausted collapse forces when is terminated.