Submicron InP DHBT Technology for High-Speed High-Swing Mixed-Signal ICs

作者: J. Godin , V. Nodjiadjim , M. Riet , P. Berdaguer , O. Drisse

DOI: 10.1109/CSICS.2008.28

关键词:

摘要: We report on the development of a submicron InP DHBT technology, optimized for fabrication ges50-GHz- clock mixed-signal ICs. In-depth study device geometry and structure has allowed to get needed performances yield. Special attention been paid critical thermal behavior. Various size devices have modeled using UCSD- HBT equations. These large signal models design 50-GHz clocked 50 G Decision 100 Selector circuits. The high quality measured characteristics demonstrates suitability this technology various applications interest, like Gbit/s transmission.

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