作者: Shiyuki Kanisawa , Akira Ishigami , Hidetsugu Namiki
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摘要: Provided is a light emitting device which has high connection reliability. This provided with substrate (10) having wiring pattern (11), an anisotropic conductive adhesive (23) that arranged on electrode (12) of the and element (30) mounted (23). The and/or (31) plated AuSn alloy layer (34). contains epoxy compound, acid anhydride, white inorganic particles (8), each obtained by covering resin particle Au layer. Due to layers particles, electrical between able be maintained even if crack occurs in eutectic bonding part, thus this achieve reliability.