Vertically integrated MEMS structure with electronics in a hermetically sealed cavity
作者： Anthony Francis Flannery , Steven S. Nasiri
DOI:
关键词:
摘要: A MEMS assembly having a subassembly sandwiched between and bonded to cap base is provided. The includes at least one device element flexibly connected the assembly. vertical separation an electrode on lithographically defined. Precise control of this critical gap dimension thereby
lens.org 参考文章(23)
Maurice S. Karpman, Wafer level method of capping multiple MEMS elements ,(2000)
Silvia Kronmueller, Aaron Partridge, Markus Lutz, Method of fabricating microelectromechanical systems and devices having trench isolated contacts ,(2003)
David H. Hinzel, Charles L. Goldsmith, Lloyd F. Linder, Method of intergrating mems device with low-resistivity silicon substrates ,(2001)
Kin P. Cheung, Processes for hermetically packaging wafer level microscopic structures ,(2003)
Valluri Rao, Peng Cheng, Qing Ma, MEMS device integrated chip package, and method of making same ,(2003)
Kristofer S. J. Pister, Oscar M. Stafsudd, Phyllis R. Nelson, Amit Burstein, William J. Kaiser, Cmos integrated microsensor with a precision measurement circuit ,(1995)
Terry V. Roszhart, Micromachined acceleration and coriolis sensor ,(1996)
Sean S. Cahill, David W. Burns, Steven S. Nasiri, Janusz Bryzek, Compensated semiconductor pressure sensor ,(1998)
Christopher C. Beatty, Microchip assembly with electrical element in sealed cavity ,(1995)