Processes for hermetically packaging wafer level microscopic structures
作者： Kin P. Cheung
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摘要: A process for hermetically packaging a microscopic structure including MEMS device is provided. The the present invention includes steps of depositing capping layer sacrificial material patterned by lithography over supported on substrate, support dielectric layer, providing plurality vias through lithography, removing via wet etching to leave intact in form shell having cavity occupied structure, metal that thick enough provide barrier against gas permeation, but thin open, and selectively applying under high vacuum laser beam proximate each sufficient period time melt sealing via.
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