Thin film encapsulation of mems devices
作者： Carl B. Freidhoff
DOI:
关键词:
摘要: A method of manufacturing a miniature electromechanical system (MEMS) device includes the steps forming moving member on first substrate such that sacrificial layer is disposed between and substrate, encapsulating member, including layer, with second coating film formed material establishes an hermetic seal removing layers.
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