Cathodic delamination of methyl methacrylate-based dry film polymers on copper
作者： J. M. Atkinson , R. D. Granata , H. Leidheiser , D. G. McBride
DOI: 10.1147/RD.291.0027
关键词:
摘要: Studies of the bond degradation between a laminated organic coating and copper substrate have been carried out using electrochemical techniques. The failure is attributed to cathodic reaction which occurs under coating. rates delamination are shown be affected by delay time after exposure, temperature, applied potential, composition electrolyte, surface abrasion prior application
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sci-hub.se 参考文章(8)
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