Packaged stacked semiconductor die and method of preparing same

摘要: A method of packaging semiconductor devices is described. In one embodiment, the comprises providing a section wafer mount tape, applying an adhesive layer to stretching tape and layer, attaching stretched cutting being cut into plurality die, curing tape. further embodiments, removing at least die from removed having portion coupled thereto, wire bonds coupling on thereto. another aspect, present invention directed stacked that comprise first upper surface, second positioned above bottom between each comprised surfaces, surface thereby defining contact area, area less than area.