Method of dividing a semiconductor wafer
作者： Akihito Kawai
DOI:
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摘要: A method of dividing a semiconductor wafer comprising: bonding film adhering step for die to the back surface wafer; protective adhesive tape affixing an extensible side having on surface; affixed into individual chips by applying laser beam along streets; breaking every chip extending so as give tensile force film; and removing broken from tape.
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