Seed layer deposition in microscale features

摘要: A method and system for coating the interior surfaces of microscale hole features fabricated into substantially planar surface a work piece. The comprises providing piece with barrier metal that is continuous uniform both along inner wherein said applied by reaction limited process. workpiece provided coating, on piece, thick layer anchored to coat disposed provide electrical conduction capability located throughout across workpiece. An contact path electrically conductive at perimeter immersed in chemical bath, causing bath fully features, containing ions suitable electrodeposition. electric potential cause electrodeposition onto all including predetermined finish one step.