Mechanisms of beta-Sn nucleation and microstructure evolution in Sn-Ag-Cu solders containing titanium
作者： Z.L. Ma , H. Shang , A.A. Daszki , S.A. Belyakov , C.M. Gourlay
DOI: 10.1016/J.JALLCOM.2018.11.097
关键词:
摘要: Abstract The mechanisms by which Ti additions catalyse the nucleation of β-Sn are studied in 550 μm Sn-3Ag-0.5Cu (wt%) solder balls and joints on Cu Ni substrates. It is shown that at least two new intermetallic compounds (IMCs), Ti2Sn3 (Ti,Fe,Cu)Sn2, form as a result 0.2 wt% addition. potential each IMC was electron backscatter diffraction (EBSD) tin droplets solidified cross sectioned facets IMC. found reproducible orientation relationships (ORs) only between ORs generate good atomic matching Sn atoms closest packed plane β-Sn, {100}. cyclic twinning occurred where axis 〈100〉Sn always parallel with lowest disregistry direction ORs. In joints, addition triggered up to 12 independent grains, whereas Ti-free SAC305 one grain.
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