Bromine adsorption, reaction, and etching of Cu(100)

作者: C.Y. Nakakura , E.I. Altman

DOI: 10.1016/S0039-6028(96)00950-8

关键词:

摘要: … -temperature dry-etching processes for Cu has delayed the introduction of devices with Cu interconnects (Etching temperatures must be kept low to prevent degradation of polymer etch …

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