Halide formation and etching of Cu thin films with Cl2 and Br2
作者： Seongju Park , T. N. Rhodin , L. C. Rathbun
DOI: 10.1116/1.573465
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摘要: … large amount ofhalogens in the copper halide film may be present as molecular anions which can diffuse through the halide films. The etch rate of copper was not enhanced by the ion …
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