Closed loop liquid cooling within rf modules

作者: Paul G. Kennedy , Robin E. Hamilton

DOI:

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摘要: A self-contained coolant loop for semiconductor devices such as high power transistors. The includes a microchannel heat sink (32), micropump (36), and an air-to-liquid exchanger (34) incorporated into replaceable module (30).

参考文章(4)
Richard J. Phillips, Ralph Larson, Leon R. Glicksman, Forced-convection, liquid-cooled, microchannel heat sinks STIN. ,vol. 88, pp. 27444- ,(1988)
Walter Kiffe, Reinhold Kuhnert, Hans-Joachim Knaak, Cooling device for a power semiconductor module ,(1994)