Microwave integrated circuit mountings

摘要: An integrated circuit package having enhanced mounting density is provided. The includes a microwave and drive therefor, both accommodated in casing layer structure made of multi-layer ceramic. Through holes ceramic are utilized for wiring so that the number conductive tracks provided on same plane can be reduced enhanced. disposed vertically with respect to each other reduce overall longitudinal dimension enhance density. High frequency connectors adapted feed high signals circuit, connector pins supply external control power signal connected underside surface casing. A through hole horse shoe type formed one dielectric members, metallic material filled therein provide an conductor coaxial tracks. Alternatively, this processed by plating or like improve electrical characteristics.