Improvements in or relating to microwave integrated circuit packages

摘要: This disclosure retates to the packaging of microwave integrated circuits (MICs) whereby an MIC is hermetically seated within enclosure comprising a first plate (10) dielectric material which carries circuit be enclosed, wall (3) sealed surface surrounding and second (4) providing lid over complete enclosure. The planar conductors (13,15) define at least one transmission line, eg microstrip, extending across into from outside provide direct coupling enclosed thereby obviating usual need for transistions coaxial cable. Part or all may contained recess (2) provided by forming aperture in sealing third (9) below.