作者: J. G. Korvink , H. Baltes , J. Funk , G. Wachutka
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摘要: We describe our simulation framework for coupled electro-thermo-mechanical (ETM) analysis of miniaturized transducers and electronic devices. The package is tailored to the specific requirements micro-electro-mechanical structure design. It achieves high computational accuracy performance on engineering workstations through use an automatic mesh adaptation algorithm [1]. A zone-coupling scheme allows a considerable reduction degrees freedom (Dofs). fast linear solver with near-optimal finite element data structures enables solution complex devices up 100,000 elements workstation.