作者: Tetsuya Nishiguchi , Shigeru Saito , Naoto Kameda , Mitsuru Kekura , Hidehiko Nonaka
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摘要: Ultraviolet-enhanced, highly concentrated (>90 vol %) ozone gas annealing was carried out at 200 °C to fabricate as-deposited tetraethoxysilane chemical vapor deposited SiO2 film (TEOS-CVD films) applicable as a gate dielectric material for thin-film transistors. As result of this annealing, the leakage current density, fixed charge and constant films decreased those thermally grown silicon oxide. The relative constant, example, reduced from 5.4 4.0. films' resistance wet-etching solution also improved, particularly within region located 3–5 nm surface. In region, reduction in amount excess positive charges Si increase density an ideal Si–O bonding network were confirmed X-ray photoelectron spectroscopy measurements. These results suggest that oxygen atoms are incorporated into film, while impurities contained such OH gassed by diffusion generated photo dissociation phase. effects with without atom supply compared mechanism is discussed.