作者: J.W. Tschanz , S. Narendra , R. Nair , V. De
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摘要: Adaptive supply voltage as well adaptive body bias may be used to control the frequency and leakage distribution of fabricated microprocessor dies. Test chip measurements show that V/sub CC/ is effective in reducing impact parameter variations on frequency, active power, power microprocessors when 20 mV resolution used. Using together with BS/ or within-die much more than using any them individually.