Single-chamber sequential curing of semiconductor wafers
作者： George Kamian , Krishnan Shrinivasan , Steve Gentile , Mark Yam , Feng Wang
DOI:
关键词:
摘要: The present invention relates to curing of semiconductor wafers. More particularly, the cure chambers containing multiple stations, each featuring one or more UV light sources. wafers are cured by sequential exposure sources in station. In some embodiments, remain stationary with respect source during exposure. other there is relative movement between and wafer also provides that may be used independently modulate cross-linking, density increase stress a material providing independent control temperature intensity.
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