Wire bonding apparatus

摘要: In the first operating unit (33), bonding gap and loop length of wire are calculated from second points (2,7). (34), (h) oblique line wire, angle (ϑ) made between a connecting inner lead bed together gap, length, height (RL). automatic (35), reverse height, i.e. distance by which capillary (37) is moved upward pad position, amount (R), (37), already ascended to opposite side ascending (Z), amount, highest position upper surface semiconductor chip line, angle, height.