Reduction of dielectric constant by nanovoids formed through chemical treatment on silica crosslinked polyimide and its effect on properties
作者： Taewon Yoo , Ravindra V. Ghorpade , Kwangin Kim , Juheon Lee , Sangyoup Lee
DOI: 10.1002/APP.45982
关键词:
摘要: In this study, 2,7-diamino-9-fluorenol (DAF) has been introduced to bond silica the main chain of polyimide (PI) copolymer. DAF contains a hydroxyl group that could covalently with particles. 4,4′-(Hexafluoroisopropylidene)diphthalic anhydride (6FDA) and 4,4′-oxydianiline (4,4′-ODA) have used as monomers form copolymer DAF. The variation content was controlled 5%, 7.5, 10, 12.5 wt %. Variation in contributes formation various size (100–410 nm) macroporous voids after hydrofluoric acid (HF) treatment. HF etching process dissolve structure PI films. Compared conventional films, air were formed film reduced dielectric from 4.40 1.86. reduction constants can be explained terms creating particles increase presence thermal stability stable up 500 °C modulus change confirmed dynamic mechanical analysis (DMA) evaluate effect on properties. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017, 135, 45982.
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