Apparatus for diagnosing interconnections of semiconductor integrated circuits
作者： Yasuko Hanagama , Kiyoshi Nikawa , Toyokazu Nakamura
DOI:
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摘要: The invention provides an apparatus for diagnosing a void within conductive material interconnections of semiconductor integrated circuits. A laser beam irradiating section is provided supplying thermal wave to the circuits cause rise temperature due accumulation around material, being able move in plane accomplishment scanning operation supply. voltage applying connected interconnections. current detecting amount electrical flowing through any part sense variation thereof on account so as detect material.
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