Thermal deformation measurement of the solder joints in electronic packages using electron moiré method
作者： Xie Huimin , Satoshi Kishimoto , Norio Shinya , Dai Fulong , Zou Daqing
DOI: 10.1111/J.1475-1305.1999.TB01149.X
关键词:
摘要: In this paper, electron moire method is used to measure the thermal deformation of electronic packages. order observe fringe, a holographic grid was replicated on cross section BGA type package at 150°C. This fabricated glass plate using moving point system, and measured area high temperature. Under SEM, grid(specimen grid) programmed beam scan(master interfere form patterns. The shear strain measurement technique described. Using method, strains in different solder joints were analysed. Some useful results obtained.
sci-hub.se 参考文章(3)
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