Pull-in voltage study of electrostatically actuated fixed-fixed beams using a VLSI on-chip interconnect capacitance model

摘要: A highly accurate computationally efficient closed-form model has been developed to determine the pull-in voltage of an electrostatically actuated fixed-fixed beam. The approach includes electrostatic spring softening effects due fringing field capacitances along with nonlinear hardening associated load-deflection characteristics a uniformly loaded Meijs and Fokkema's empirical formula for capacitance VLSI on-chip interconnect used capacitances. verified by comparing results published experimentally three-dimensional (3-D) finite element analysis (FEA) those from other representative models. can maximum deviation 1.27% FEA small deflections large (airgap-beam thickness ratio =12), is 2.0%. 0.5% observed extreme cases (beamwidth-airgap /spl les/0.5). model's accuracy range better compared