Supporting structure for a solid state image sensing device
作者： Jun Andoh , Tatsuya Tsuyuki
DOI:
关键词:
摘要: Disclosed is a solid state image sensing device. The device comprises semiconductor chip for which has at least one of photoelectric conversion element line; and package into the received. composed an insulating body mounted on flat inner bottom surface concave portion; transparent cover glass to be fixed upper outer frame portion sealing lead brought out outside body. reference plane attaching onto input apparatus arranged package. made parallel mounted.
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