Coated stencil with reduced surface tension
作者： Ian McPhee Fleck , Scott Craig , Prashant Chouta , Ron Tripp
DOI:
关键词:
摘要: A stencil used for printing solder paste on a contact pad of printed wiring board has interior surfaces that define one or more apertures through the stencil. Those are coated with material, such as parylene, having lower surface tension than absent coating. The can also have reverse-tapered passing there through, wherein variable cross-section is larger at fill side (i.e., where enters apertures) contacts board). Solder be aperture(s) onto pads board.
lens.org 参考文章(16)
Hermann L. Hefele, Stencils having enhanced wear-resistance and methods of manufacturing the same ,(1994)
Kenneth H. Heffner, Lance L. Sundstrom, Attaching devices using polymers ,(2001)
Peter Henry Berasi, Hsing Hsiung Chen, Corrosion resistant molybdenum mask ,(1997)
Judy Ann Sline, Gary Thomas Marks, Jerry Elden Sergent, Stephen Anthony Delucia, Daniel Robert +Di Blessington, Method for preparing and using a screen printing stencil having raised edges ,(1993)
Eric Lee Hertz, Method and apparatus using laminated foils for placing conductive preforms ,(1997)
Albert W. Chan, Theresa M. Larson, Michael G. Lee, Stencil and method for depositing solder ,(2001)
Vinh Van Ha, Jeff Jin Her Lin, John Trublowski, Method and apparatus for dispensing viscous material ,(2000)
Karl G. Hoebener, Eric M. Hubacher, Method for forming bumps on a substrate ,(1997)
Eric M. Hubacher, Karl G. Hoebener, Julian P. Partridge, Fine pitch solder deposits on printed circuit board process and product ,(1994)
Dennis G. Doyle, Gary T. Freeman, Steven W. Hall, Dual track stenciling system with solder gathering head ,(1998)