Wafer level thin film encapsulation for MEMS

摘要: Because they have moving parts, or because need to work in a specific atmosphere (vacuum, inert gas, etc.), micro-electromechanical systems (MEMS) are not compatible with standard integrated circuit (IC) packaging technologies. Specific needs represent great part of the final manufacturing cost such devices. This article presents solution encapsulate RF MEMS devices hermetically sealed cavities, using only IC technologies at wafer level. A polymer sacrificial layer is deposited on devices, and then covered dielectric cap. The cap perforated lithography/etching process enable removing by dry process. finally vacuum deposit. thin film pre-packaging enables protection greatly reduces packaging. simplified device was designed encapsulated under presented It allows measure pressure evolution inside cavity this way check hermeticity package