in-situ electromigration study on Sn−Ag−Cu solder joint by digital image speckle analysis
作者： Luhua Xu , John H. L. Pang
DOI: 10.1007/S11664-006-0305-8
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摘要: The phenomenon of electromigration in Pb-free Sn-Ag-Cu solder joint specimen subject to high current density was characterized. Electromigration measurements the direction electron flux, via Cu metal lines, ENIG metallization, and is documented. consequence this migration causes void formation significant accumulation voiding a serious reliability concern. Digital image speckle analysis (DISA) used measure in-situ micro-deformation cross sectioned joints, which with 5*10/sup 3/A/cm/sup 2/ under constant temperature 150/spl deg/C. deformation strain field were analyzed by digital correlation software. After 120hrs thermal-current test, higher near large voids detected. IMC growth behavior with/without are compared. It noted that layer on anode interface faster than cathode interface, both isothermal aging.
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