作者: David R. Clarke , Linda L. Rapp , Sarah H. Knickerbocker , Bernard Schwartz , Richard W. Adams
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摘要: A ceramic material suitable for packaging of large scale integrated circuits is produced by the process forming a mixture powdered glass which glassy precursor to cordierite material, formed steps are as follows: a. Mix tetragonal phase selected from group consisitng zirconia or hafnia powder containing stabilizing oxide compound consisting MgO, CaO and Y 2 O 3 frit yield suspension solids. Preferably, binder included. b. Disperse suspended solids dispersion with precursor. c. Densify sintering heat treatment at temperature about 840° C. melt into viscous fluid below melting point particles densified intermediate encapsulated in molden percursor. d. Crystallize polycrystalline composite heating 900° 950° The yields crystalline material. This invention continuation part application Ser. No. 07/146,455 filed on Jan. 21, 1988 now abandoned was 06/892,687 Aug. 1, 1986 abandoned.