The influence of oxidation-sirtl etch condition on the stacking fault generation in (111) silicon wafers

作者: Y. Sugita , T. Aoshima , K. Yoneda , A. Yoshinaka

DOI: 10.1007/BF02657843

关键词:

摘要: The successive oxidation-Sirtl etch technique has been investigated to evaluate the perfection of silicon crystals by detecting extrinsic stacking faults produced during oxidation. Experiments were performed in (111) epitaxial wafers. Measured densities found epend on conditions thermal oxidation, and fault a maximum at an oxidation temperature around 1100°C. reduced appreciably when wafers chemically etched remove several tens microns prior test. generation is thought occur heterogeneous nucleation due very small amount unidentified impurity crystals.

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