Mechanism for stamp collapse in soft lithography
作者： W. Zhou , Y. Huang , E. Menard , N. R. Aluru , J. A. Rogers
DOI: 10.1063/1.2149513
关键词:
摘要: Mechanical collapse of recessed features relief on elastomeric elements for soft lithography represents an important phenomena this lithographic technology. By comparing computed and measured shapes partially collapsed structures, we show that the dominant mechanism is surface adhesion between elastomer substrate, typical materials processing conditions. In particular, obtained using models account agree well with experimentally shapes. Electrostatic forces may contribute to process, but they do not dominate. The weight has essentially no effect.
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