Collapse of stamps for soft lithography due to interfacial adhesion
作者： K. J. Hsia , Y. Huang , E. Menard , J.-U. Park , W. Zhou
DOI: 10.1063/1.1900303
关键词: Nanotechnology 、 Interfacial adhesion 、 Surface energy 、 Groove (music) 、 Materials science 、 Soft lithography 、 Collapse (topology) 、 Mechanics 、 Gravitational force 、 Adhesion 、 Elastomer
摘要: Collapse of elastomeric elements used for pattern transfer in soft lithography is studied through experimental measurements and theoretical modeling. The objective is to identify …
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