Mechanical and Electrical Characterization of Benzocyclobutene Membrane Packaging
作者： S. Seok , N. Rolland , P.-A. Rolland
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摘要: A whole benzocyclobutene (BCB) membrane zero-level packaging using a wafer level bonding technique is presented. Wafer-scale transfer silicon carrier wafers was used to make BCB caps placed above the device wafers. multiple coating process CYCLOTENE 4026-46 developed for an encapsulation cap. The average height of implemented cap approximately 40 mum with little curvature dimension 2 mm x 3 mm. Hermeticity improved by depositing 0.5 um-thick PECVD nitride on membrane, which verified vacuum chamber test and ANSYS model describe movement depending level. Mechanical resonant frequency also characterized 7.5 kHz optical measurement. In addition, RF characterization coplanar waveguide (CPW) line thin-film resonator were performed estimate effect film package from DC 110 GHz. packaged showed change 100 MHz at 62.5 GHz resonance 200 104
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