Enhancement of current-carrying capacity of a multilayer circuit board
作者： Koji Kondo , Gentaro Masuda , Ryohei Kataoka
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摘要: A multilayer circuit board, in which a plurality of insulating layers and conductive layers, each includes pattern, have been laminated, an layer, compound, pattern. The layer has trench. compound is located the pattern adjoins trench electrically connected to compound. make up wire that higher current-carrying capacity than
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