Paste including a mixture of powders, connection plug, burying method, and semiconductor device manufacturing method
作者： Yoshimi Hisatsune , Nobuo Hayasaka , Manabu Kimura , Keiichi Sasaki
DOI:
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摘要: Form a trench in major surface of semiconductor substrate, then bury paste the trench. The contains solids having conductive substance and resin, solvent for dissolving resin. content is not less than 60 vol % viscosity ratio thereof more 2.
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