Electrical connection between two surfaces of a substrate and method for producing same

作者: Robert Cuchet , Olivier Girard , Line Vieux-Rochaz

DOI:

关键词: Substrate (electronics)ConductorTrenchMaterials scienceElectronic circuitElectrical connectionContact padConnection (mathematics)OptoelectronicsElectrical conductorElectronic engineering

摘要: The invention concerns an electrical connection between two surfaces of a substrate and method for producing such connection. Said consists part (46) conductor or semiconductor (20) completely surrounded by at least electrically insulating trench (32, 36, 44). A contact pad (42) is arranged on the rear surface (40) strip conductors (38) front surface. produced itself. useful circuits, components, sensors like.

参考文章(6)
Samson Berhane, Barry C. Snyder, Hubert A. Vander Plas, Diane W. Lai, Ronald A. Hellekson, Method of forming a through-substrate interconnect ,(2002)
Johann Greschner, Howard L. Kalter, H. Bernhard Pogge, Very dense integrated circuit package ,(1997)