An in situ examination of atomic layer deposited alumina/InAs"100… interfaces

作者: A. P. Kirk , M. Milojevic , J. Kim , R. M. Wallace

DOI: 10.1063/1.3432749

关键词: Layer (electronics)X-ray photoelectron spectroscopyInorganic chemistryAtomic layer depositionChemical stateArsenicMaterials scienceChemical vapor depositionPassivationIndiumAnalytical chemistry

摘要: Undoped InAs(100) wafers were either passivated with sulfur from a (NH4)2Sx solution or etched NH4OH and then characterized monochromatic x-ray photoelectron spectroscopy (XPS) before after in situ deposition of Al2O3 by atomic layer deposition. Sulfur passivation minimized oxidation. Trimethyl aluminum (TMA) exposure reduced trivalent indium arsenic oxidation states. The In1+ chemical state persisted while elemental remained at the Al2O3/InAs interface prior to TMA possibly mixture As–As As–Al bonds present afterwards. In 3d5/2 peak line shape bulk InAs differed previous XPS experiments on epitaxial InxGa1−xAs.

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