Bond pad structure and fabricating method thereof
作者： Kuan-Yu Wang , Ming-I Wang , Hui-Min Wu , Chien-Hsin Huang , Kun-Che Hsieh
DOI:
关键词: Interconnection 、 Materials science 、 Metal 、 Isolation layer 、 Composite material 、 Dielectric layer 、 Structural engineering
摘要: A bond pad structure comprises an interconnection and isolation layer. The dielectric layer has opening a metal pad. is disposed on the extends into until it in contact with pad, whereby sidewalls of blanketed by layer, portion exposed from opening.
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