Vertically integrated MEMS sensor device with multi-stimulus sensing
作者： Yizhen Lin , Todd F. Miller , Woo Tae Park , David J. Monk
DOI:
关键词: Microelectromechanical systems 、 Mems sensors 、 Wafer bonding 、 Stimulus sensing 、 Materials science 、 Acoustics 、 Sense (electronics) 、 Surface micromachining 、 Electrical engineering
摘要: A microelectromechanical systems (MEMS) sensor device ( 184 ) includes a portion 180 and 182 that are coupled together to form vertically integrated configuration having hermetically sealed chamber 270 ). The portions 180, can be formed utilizing different micromachining techniques, subsequently wafer bonding technique the one or more sensors 186, 188 ), 236, 238 located inside facing also 188, configured sense physical stimuli, such as motion, pressure, magnetic field.
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