Structuring of DLC:Ag nanocomposite thin films employing plasma chemical etching and ion sputtering
作者： Tomas Tamulevičius , Asta Tamulevičienė , Dainius Virganavičius , Andrius Vasiliauskas , Vitoldas Kopustinskas
DOI: 10.1016/J.NIMB.2013.09.052
关键词: Plasma processing 、 Sputtering 、 Thin film 、 Plasma etching 、 Sputter deposition 、 Etching (microfabrication) 、 Reactive-ion etching 、 Analytical chemistry 、 Isotropic etching 、 Materials science
摘要: … Employing contact lithography and 4 μm period mask in … chemical etching, direct Ar + sputtering or combined etching processes. It … etching in CF 4 /O 2 gas mixture with photoresist mask …
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