Interconnect structures comprising flexible buffer layers
作者： Shau-Lin Shue , Chao-Hsien Peng , Hsiang-Huan Lee , Hsin-Yen Huang
DOI:
关键词: Buffer (optical fiber) 、 Barrier layer 、 Interconnection 、 Layer (electronics) 、 Materials science 、 Substrate (electronics) 、 Line (electrical engineering) 、 Electronic engineering 、 Electrical conductor 、 Dielectric layer 、 Composite material
摘要: A structure includes a substrate, low-k dielectric layer over the and conductive barrier extending into layer. The sidewall portion. metal line in adjoins An organic buffer is between portion of
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