Organic copper diffusion barrier layer
作者： Shyh-Dar Lee
DOI:
关键词: Diffusion 、 Copper 、 Chemical engineering 、 Thermal diffusivity 、 Copper interconnect 、 Chemistry 、 Layer (electronics) 、 Diffusion barrier 、 Dielectric 、 Polymer 、 Inorganic chemistry
摘要: An organic copper diffusion barrier layer having low dielectric constant is provided. The can be applied to a dual damascene structure, which formed between wiring and an layer, defend from the into layer. includes benzocyclo polymer, it has benzene ring functional group that catch prevent diffusing problem of thermal electro-migration avoided.
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