Integrated circuit packaging architecture

作者: Dustin P. Wood , Brent Stone

DOI:

关键词: Integrated circuit packagingQuad Flat No-leads packagePackage on packageComputer hardwareInterposerGround contactIntegrated circuitInterface (computing)Engineering

摘要: A system may include an integrated circuit package having a power contact and ground contact, interposer to physically receive portion of the including lip. also first card interface with where defines opening interposer, lip is support card.

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