作者: Dustin P. Wood , Brent Stone
DOI:
关键词: Integrated circuit packaging 、 Quad Flat No-leads package 、 Package on package 、 Computer hardware 、 Interposer 、 Ground contact 、 Integrated circuit 、 Interface (computing) 、 Engineering
摘要: A system may include an integrated circuit package having a power contact and ground contact, interposer to physically receive portion of the including lip. also first card interface with where defines opening interposer, lip is support card.