1T MIM memory for embedded ram application in soc
作者： Shou-Gwo Wuu , Chen-Jong Wang , Kun-Lung Chen , Chien-Hua Huang , Ping Yang
DOI:
关键词: Dielectric 、 Electrical engineering 、 Transistor 、 Optoelectronics 、 Substrate (printing) 、 Materials science 、 Capacitor 、 Electrical conductor 、 Dielectric layer
摘要: Embedded memories. The devices include a substrate, first dielectric layer, second third and plurality of capacitors. substrate comprises transistors. embedding conductive plugs electrically connecting the transistors therein, overlies substrate. comprising capacitor openings exposing plugs, layer. capacitors comprise bottom plates, respectively disposed in openings, layers overlying top plate, plate opening, layers. opening exposes is shared by
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