Antimicrobial copper alloy surfaces are effective against vegetative but not sporulated cells of gram-positive Bacillus subtilis

作者: Kaungmyat San , Janet Long , Corinne A. Michels , Nidhi Gadura

DOI: 10.1002/MBO3.276

关键词: BiologyCopperPhospholipidLipid peroxidationProgrammed cell deathBacillus subtilisAntimicrobial properties of copperEndosporeStrain (chemistry)Microbiology

摘要: This study explores the role of membrane phospholipid peroxidation in copper alloy mediated contact killing Bacillus subtilis, a spore-forming gram-positive bacterial species. We found that B. subtilis endospores exhibited significant resistance to surface but vegetative cells were highly sensitive exposure. Cell death and lipid occurred upon In sporulation-defective strain carrying deletion almost entire SpoIIA operon, directly correlated with cell death. Moreover, initiated immediately at constant rate exposure without delay observed previously E. coli. These findings support hypothesis is initiating event causing induced cells. The suggest differences kinetics copper-induced compared E. coli result from envelop structure. As demonstrated E. coli, DNA degradation was shown be secondary effect strain.

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