作者: Pejman Monajemi , Paul J Joseph , Paul A Kohl , Farrokh Ayazi
DOI: 10.1088/0960-1317/16/4/010
关键词: Optoelectronics 、 Surface micromachining 、 Packaging engineering 、 Thin film 、 Microelectromechanical systems 、 Electronic engineering 、 Materials science 、 Q factor 、 Wafer 、 Resonator 、 Gyroscope
摘要: This paper reports on the design, implementation and characterization of wafer-level packaging technology for a wide range microelectromechanical system (MEMS) devices. The encapsulation technique is based thermal decomposition sacrificial polymer through overcoat to form released thin-film organic membrane with scalable height top active part MEMS. Hermiticity vacuum operation are obtained by deposition metal such as chromium, aluminum or gold. thickness can be optimized according size device differential pressure package variety MEMS resonators, accelerometers gyroscopes. key performance metrics several batches packaged devices do not degrade result residues from polymer. A Q factor 5000 at resonant frequency 2.5 MHz resonator, static sensitivity 2 pF g −1 accelerometer were obtained. Cavities small 0.000 15 mm 3 resonator large 1 have been made this method. (Some figures in article colour only electronic version)