Multi-level load lock chamber, transfer chamber, and robot suitable for interfacing with same

作者: Robert B. Moore , Satish Sundar , Eric Ruhland , Mario David Silvetti

DOI:

关键词: Transfer (computing)InterfacingRobotEngineeringProcess (computing)Record lockingComputer hardware

摘要: A new apparatus for processing substrates is disclosed multi-level load lock chamber (10) having four environmentally isolated chambers interfaces with a transfer (400) that has robotic assembly (600) The two arms (618) each move horizontally as the rotates about its axis reach into of to receive from bottom chamber, transport process chambers, and then place in upper have pivotally attached lid may be opened access inside

参考文章(39)
Martin J. Seamons, Priya Kulkarni, Sudha S.R. Rathi, Wendy H. Yeh, Mark A. Fodor, Thomas Nowak, Soovo Sen, Visweswaren Sivaramakrishnan, Tsutomu Shimayama, Process kit design for deposition chamber ,(2004)
Inna Shmurun, Mark Fodor, Son T. Nguyen, Yen-Kun Victor Wang, Himanshu Pokharna, Chen-An Chen, Kelly Fong, Low profile thick film heaters in multi-slot bake chamber ,(2001)
Howard Daley, Craig Bienick, Appliance door or lid ,(2003)
Martin Jay Seamons, Sudha S. R. Rathi, Wendy H. Yeh, Heraldo L. Botelho, Methods for the reduction and elimination of particulate contamination with cvd of amorphous carbon ,(2004)
Yaxin Wang, Xiaoliang Jin, Sean Seutter, Tandem wafer processing system and process ,(2002)