Interconnection elements with encased interconnects
作者： Ilyas Mohammed , Belgacem Haba
DOI:
关键词: Signal 、 Optoelectronics 、 Materials science 、 Interconnection 、 Electronic engineering 、 Electrical conductor 、 Microelectronics 、 Dielectric layer
摘要: An interconnection element is disclosed that includes a plurality of drawn metal conductors, dielectric layer, and opposed surfaces having wettable contacts thereon. The conductors may include grains lengths oriented in direction between the first second ends conductors. A layer for insulating have thickness less than 1 millimeter surface. One or more be configured to carry signal from microelectronic element. First used bond at least one circuit panel. match spatial distribution face exposed component other
lens.org 参考文章(14)
Fritz Juergen Wisotzki, System for the production of grain free metal products ,(2010)
Devendra Natekar, Sriram Muthukumar, Method of manufacturing of thin based substrate ,(2004)
Craig S. Mitchell, Apolinar Alvarez, Belgacem Haba, Substrate for a microelectronic package and method of fabricating thereof ,(2012)
Robert Salvatore Antonuccio, William Anthony Izzicupo, Mathew John Palazola, Mark Richard Pugliese, Daniel Derrick Gonsalves, Joseph M. Spano, James Maurice Carney, Thomas E. Stewart, Rugged computer housing ,(1997)
Stephen M. Gates, Roy E. Scheuerlein, Formation of arrays of microelectronic elements ,(2002)
Eiji Kodera, Kouki Ogawa, Capacitor-built-in-type printed wiring substrate, printed wiring substrate, and capacitor ,(2000)
Holger Petersen, Signal routing optimized IC package ball/pad layout ,(2011)
Charles A. Miller, Benjamin N. Eldridge, High density planar electrical interface ,(2002)
Andre Hanke, Stephan Dobritz, Interconnection element for BGA housings and method for producing the same ,(2004)
James G. Ryan, Badih El-Kareh, Method of making flexible interconnections with dual-metal-dual-stud structure ,(1996)