A Reliability Statistics Perspective on the Pitfalls of Standard Wafer-Level Electromigration Accelerated Test (SWEAT)
作者： Cher Ming Tan , Kelvin Ngan Chong Yeo
关键词: Electromigration 、 Reliability (statistics) 、 Test (assessment) 、 Wafer 、 Reliability engineering 、 Wafer level reliability 、 Engineering
摘要: Standard Wafer Level Electromigration Accelerated Test (SWEAT) has become a common fast wafer level reliability test for electromigration in industry. However, its ability to detect changes processes and correlation with conventional result come under close scrutiny. From the perspective of statistics, SWEAT also other pitfalls that render results questionable. In this work, these are highlighted, alternative wafer-level tests discussed. The arguments is not appropriate evaluation metal lines presented. as tool evaluate lifetime recommended unless seriously looked at.
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